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| HPLR3103, HPLU3103 Data Sheet December 2001 52A, 30V, 0.019 Ohm, N-Channel Logic Level, Power MOSFETs These are N-Channel enhancement mode silicon gate power field effect transistors. They are advanced power MOSFETs designed, tested, and guaranteed to withstand a specified level of energy in the breakdown avalanche mode of operation. All of these power MOSFETs are designed for applications such as switching regulators, switching converters, motor drivers, relay drivers, and drivers for high power bipolar switching transistors requiring high speed and low gate drive power. These types can be operated directly from integrated circuits. Features * Logic Level Gate Drive * 52A, 30V * Low On-Resistance, rDS(ON) = 0.019 * UIS Rating Curve * Related Literature - TB334, "Guidelines for Soldering Surface Mount Components to PC Boards" Calculated continuous current based on maximum allowable junction temperature. Package limited to 20A continuous, see Figure 9. Ordering Information PART NUMBER HPLU3103 HPLR3103 PACKAGE TO-251AA TO-252AA BRAND HP3103 HP3103 Symbol D G NOTE: When ordering, use the entire part number. Add the suffix T to obtain the TO-252AA variant in tape and reel, e.g., HPLR3103T. S Packaging JEDEC TO-251AA JEDEC TO-252AA DRAIN (FLANGE) SOURCE DRAIN GATE GATE SOURCE DRAIN (FLANGE) (c)2001 Fairchild Semiconductor Corporation HPLR3103, HPLU3103 Rev. B HPLR3103, HPLU3103 Absolute Maximum Ratings TC = 25oC, Unless Othewise Specified HPLR3103, HPLU3103 30 30 16V 52 390 240 89 0.71 -55 to 150 300 260 UNITS V V V A A mj W W/oC oC oC oC Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDSS Drain to Gate Voltage (RGS = 20k) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS Continuous Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID Pulsed Drain Current (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .IDM Single Pulse Avalanche Energy (Note 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EAS Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD Derate Above 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG Maximum Temperature for Soldering Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tpkg CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. TJ = 25oC to 125oC. Electrical Specifications PARAMETER TC = 25oC, Unless Otherwise Specified SYMBOL BVDSS VGS(TH) IDSS TEST CONDITIONS ID = 250A, VGS = 0V VGS = VDS, ID = 250A VDS = 30V, VGS = 0V VDS = 24V, VGS = 0V, TC = 125oC MIN 30 1 VDD = 24V ID 34A, VGS = 4.5V (Figure 6) VDS = 25V, VGS = 0V, f = 1MHz (Figure 5) Measured From the Source Lead, 6mm (0.25in) From Package to Center of Die Measured From the DrainLead, 6mm (0.25in) From Package to Center of Die G LS S TYP 0.037 9 210 20 54 1600 640 320 7.5 MAX 25 250 100 0.019 0.024 50 14 28 - UNITS V V A A nA V ns ns ns ns nC nC nC pF pF pF nH Drain to Source Breakdown Voltage Gate to Source Threshold Voltage Zero Gate Voltage Drain Current Gate to Source Leakage Current Breakdown Voltage Temperature Coefficient Drain to Source On Resistance (Note 3) Turn-On Delay Time Rise Time Turn-Off Delay Time (Note 3) Fall Time Total Gate Charge Gate to Source Charge Gate to Drain "Miller" Charge Input Capacitance Output Capacitance Reverse Transfer Capacitance Internal Source Inductance IGSS VGS = 16V V(BR)DSS Reference to 25oC, ID = 1mA /TJ rDS(ON) ID = 28A, VGS = 10V ID = 23A, VGS = 4.5V td(ON) tr td(OFF) tf Qg Qgs Qgd CISS COSS CRSS LS Modified MOSFET Symbol Showing the Internal Devices Inductances D LD VDD = 15V, ID 34A, RL = 0.441, VGS = 4.5V, RGS =3.4, Ig(REF) = 3mA - Internal Drain Inductance LD - 4.5 - nH (c)2001 Fairchild Semiconductor Corporation HPLR3103, HPLU3103 Rev. B HPLR3103, HPLU3103 Electrical Specifications PARAMETER Thermal Resistance Junction to Case Thermal Resistance Junction to Ambient TC = 25oC, Unless Otherwise Specified SYMBOL RJC RJA (PCB Mount Steady State) TEST CONDITIONS MIN TYP MAX 1.4 110 50 UNITS oC/W oC/W oC/W Source to Drain Diode Specifications PARAMETER Continuous Source to Drain Current SYMBOL ISD ISDM TEST CONDITIONS MOSFET Symbol Showing The Integral Reverse P-N Junction Diode D MIN - TYP - MAX 52 (Note 1) 220 UNITS A Pulsed Source to Drain Current (Note 2) G - A S Source to Drain Diode Voltage (Note 3) Reverse Recovery Time (Note 3) Reverse Recovered Charge (Note 3) NOTES: VSD trr QRR ISD = 28A ISD = 34A, dISD/dt = 100A/s ISD = 34A, dISD/dt = 100A/s - 81 210 1.3 120 310 V ns nC 2. Repetitive rating; pulse width limited by maximum junction temperature (See Figure 11). 3. Pulse width 300s; duty cycle 2%. 4. VDD = 15V, starting TJ = 25oC, L = 300H, RG = 25, peak IAS = 34A, (Figure 10). Typical Performance Curves 1000 ID, DRAIN TO SOURCE CURRENT (A) VGS IN DECENDING ORDER 15V 12V 10V 8.0V 100 6.0V 4.0V 3.0V 2.5V 10 20s PULSE WIDTH TC = 25oC 1000 ID, DRAIN TO SOURCE CURRENT (A) VGS IN DECENDING ORDER 15V 12V 10V 8.0V 100 6.0V 4.0V 3.0V 2.5V 10 1 0.1 1.0 10 100 1 0.1 20s PULSE WIDTH TC = 150oC 1 10 100 VDS, DRAIN TO SOURCE VOLTAGE (V) VDS, DRAIN TO SOURCE VOLTAGE (V) FIGURE 1. OUTPUT CHARACTERISTICS FIGURE 2. OUTPUT CHARACTERISTICS (c)2001 Fairchild Semiconductor Corporation HPLR3103, HPLU3103 Rev. B HPLR3103, HPLU3103 Typical Performance Curves 1000 ID, DRAIN TO SOURCE CURRENT(A) VDS = 15V 20s PULSE WIDTH NORMALIZED DRAIN TO SOURCE 2.0 ON RESISTANCE (Continued) 2.5 PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX ID = 46A, VGS = 10V 100 TJ = 25oC 1.5 10 TJ = 150oC 1.0 0.5 1 2 3 4 5 6 7 8 9 VGS, GATE TO SOURCE VOLTAGE (V) 0 -80 -40 0 40 80 120 TJ, JUNCTION TEMPERATURE (oC) 160 200 FIGURE 3. TRANSFER CHARACTERISTICS FIGURE 4. NORMALIZED DRAIN TO SOURCE ON RESISTANCE vs JUNCTION TEMPERATURE 3200 2800 C, CAPACITANCE (pF) 2400 2000 1600 1200 800 400 0 1 10 VDS, DRAIN TO SOURCE VOLTAGE (V) 100 COSS CISS VGS, GATE TO SOURCE VOLTAGE (V) VGS = 0V, f = 1MHz CISS = CGS + CGD CRSS = CGD COSS CDS + CGS 20 ID = 34A 16 VDS = 15V 12 VDS = 24V 8 4 CRSS 0 0 10 20 30 40 QG , TOTAL GATE CHARGE (nC) FIGURE 5. CAPACITANCE vs DRAIN TO SOURCE VOLTAGE FIGURE 6. GATE CHARGE WAVEFORMS FOR CONSTANT GATE CURRENT 1000 ISD, REVERSE DRAIN CURRENT(A) PULSE DURATION = 80s DUTY CYCLE = 0.5% MAX ID = 46A, VGS = 10V 1000 ID, DRAIN CURRENT (A) 10s 100 100s OPERATION IN THIS AREA MAY BE LIMITED BY rDS(ON) 100 TJ = 175oC TJ = 25oC 10 1ms 10ms 10 0.4 0.8 1.2 1.6 2.0 2.4 2.8 VSD, SOURCE TO DRAIN VOLTAGE (V) 1 1 VDSS MAX = 30V 10 VDS, DRAIN TO SOURCE VOLTAGE (V) 100 FIGURE 7. SOURCE TO DRAIN DIODE FORWARD VOLTAGE FIGURE 8. FORWARD BIAS SAFE OPERATING AREA (c)2001 Fairchild Semiconductor Corporation HPLR3103, HPLU3103 Rev. B HPLR3103, HPLU3103 Typical Performance Curves 60 (Continued) 1000 IAS, AVALANCHE CURRENT (A) If R = 0 tAV = (L)(IAS)/(1.3*RATED IASVDSS - VDD) If R 0 tAV = (L/R)ln[(IAS*R)/(1.3*RATED BVDSS - VDD) +1] EAS POINT STARTING TJ = 25oC 10 ID, DRAIN CURRENT (A) 45 100 30 15 STARTING TJ = 150oC 0 25 50 75 100 125 150 1 TC, CASE TEMPERATURE (oC) 0.001 0.01 1 0.1 tAV, TIME IN AVALANCHE (ms) 10 100 FIGURE 9. MAXIMUM CONTINUOUS DRAIN CURRENT vs CASE TEMPERATURE FIGURE 10. UNCLAMPED INDUCTIVE SWITCHING CAPABILITY 2 1 THERMAL IMPEDANCE ZJC, NORMALIZED DUTY CYCLE - DESCENDING ORDER 0.5 0.2 0.1 0.05 0.02 0.01 PDM t1 SINGLE PULSE t2 NOTES: DUTY FACTOR: D = t1/t2 PEAK TJ = PDM x ZJC x RJC + TC 10-3 10-2 10-1 t, RECTANGULAR PULSE DURATION (s) 100 101 0.1 0.01 10-5 10-4 FIGURE 11. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE Test Circuits and Waveforms VDS BVDSS L VARY tP TO OBTAIN REQUIRED PEAK IAS VGS DUT tP RG IAS VDD tP VDS VDD + 0V IAS 0.01 0 tAV FIGURE 12. UNCLAMPED ENERGY TEST CIRCUIT FIGURE 13. UNCLAMPED ENERGY WAVEFORMS (c)2001 Fairchild Semiconductor Corporation HPLR3103, HPLU3103 Rev. B HPLR3103, HPLU3103 Test Circuits and Waveforms VDS RL Qgd Qgs VGS + (Continued) VDD Qg(TOT) VGS VDD DUT IG(REF) IG(REF) 0 0 VDS FIGURE 14. GATE CHARGE TEST CIRCUIT FIGURE 15. GATE CHARGE WAVEFORMS VDS tON td(ON) RL VDS + tOFF td(OFF) tr tf 90% 90% VGS DUT RGS VDD 0 10% 90% 10% VGS VGS 0 10% 50% PULSE WIDTH 50% FIGURE 16. SWITCHING TIME TEST CIRCUIT FIGURE 17. RESISTIVE SWITCHING WAVEFORMS (c)2001 Fairchild Semiconductor Corporation HPLR3103, HPLU3103 Rev. B TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACExTM BottomlessTM CoolFETTM CROSSVOLTTM DenseTrenchTM DOMETM EcoSPARKTM E2CMOSTM EnSignaTM FACTTM FACT Quiet SeriesTM DISCLAIMER FAST (R) FASTrTM FRFETTM GlobalOptoisolatorTM GTOTM HiSeCTM ISOPLANARTM LittleFETTM MicroFETTM MicroPakTM MICROWIRETM OPTOLOGICTM OPTOPLANARTM PACMANTM POPTM Power247TM PowerTrench (R) QFETTM QSTM QT OptoelectronicsTM Quiet SeriesTM SILENT SWITCHER (R) SMART STARTTM STAR*POWERTM StealthTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TinyLogicTM TruTranslationTM UHCTM UltraFET (R) VCXTM STAR*POWER is used under license FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life systems which, (a) are intended for surgical implant into support device or system whose failure to perform can the body, or (b) support or sustain life, or (c) whose be reasonably expected to cause the failure of the life failure to perform when properly used in accordance support device or system, or to affect its safety or with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Preliminary First Production No Identification Needed Full Production Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. H4 |
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